Webcast: Photonic integrated circuits packaging and assembly: PICs basis and applications

Friday 23 February, 2pm (GMT), 3pm (CET)

Who should attend?
The webinars are addressed to engineers and researchers working on and interested in the development of PIC devices, specially in assembly and packaging and standardisation. Register to meet the European leaders in packaging of PICs. 
 
Introduction
Photonic Integrated Circuits (PICs) based products overcome the limitations of actual technologies in the field of telecommunications, medical and industry by offering advanced capabilities such as a reduction in the power consumption, real-time and unattended monitoring of processes, unprecedent sensitivity levels, minituarisation capabilities, and the possibility to integrate them in already existing equipment. Currently, PICs based devices have already reached mass markets such as cell phones and their presence in everyday products is going to exponentially increase inthe future. We offer here a series of webinars dedicated to the development of PIC products, from technology and applications to packaging and testing. The webinars consist of different talks in which you will have the opportunity to interact with top-level speakers in the field of PICs and packaging. Atteendees will be able to ask questions and actively participate in the discussion.
 
The first webinar is focused on the fundamentals of PIC based devices and packaging, Dr Ana Gonzalez (European Photonics Industry Consortium, EPIC) will offer an overview of the different technologies, EU capabilities and possible applications for PIC products and Dr Lee Carroll (Tyndall Institute) will talk about packaging and assembly of PICs.
 
The webinar is organised by PIXAPP, the world’s first open-access Photonic Integrated Circuit (PIC) Assembly and Packaging Pilot Line. A highly-interdisciplinary team of Europe’s leading industrial & research organisations, that provides users with single-point access to PIC assembly and packaging. PIXAPP bridges the ‘valley of death’ often associated with moving from prototyping to low-volume fabrication, by giving companies an easy-access route to transferring R&D results to the market. For more information please visit www.pixapp.eu. and follow us @eu_PIXAPP or in the LinkedIn group: Photonic integrated circuits: assembly, packaging and test (https://www.linkedin.com/groups/12075991)