Osram Opto Semiconductor is significantly increasing its production output by converting its two chip manufacturing facilities to 6-inch wafers while expanding production at both plants. A new production building is currently under construction in Penang, Malaysia, while in Regensburg, Germany, the existing space is being reallocated. The two facilities will each be converting to the new manufacturing technology, introducing 6-inch wafers to replace the current 4-inch wafers. These measures are expected to almost double the chip production capacity for white LEDs by the end of 2012. The capacity expansion will primarily affect InGaN chips employing thin-film and UX:3 technology, which are required in the production of white LEDs.
The company aims to capitalise on the growth potential of international LED markets. 'By expanding our capacities for high-performance InGaN chips, we are consistently consolidating our market position. The LED market harbors great growth potential in many different fields of application and we intend to continue harnessing this,' said Aldo Kamper, CEO of Osram Opto Semiconductors.
