Schott has entered into an agreement to acquire Primoceler, a Finnish specialist in glass micro bonding, to advance its competance in the field of hermetic packaging.
Primoceler’s technology creates new possibilities for protection of sensitive electronics in medical implants, MEMS devices and other applications.
Hermetic packaging refers to the sealing of electrical contacts with glass or ceramics. These inorganic and virtually non-ageing materials are used as insulators that prevent the intrusion of moisture and other contaminants. The challenge lies in achieving a perfect bond between the electrical metal conductors and glass – Schott provides technologies from glass-to-metal and ceramic-to-metal sealing.
Primoceler has developed a 'glass-only' micro bonding method based on laser technology that can be completed without any heat or added materials. This bonding process allows for the manufacture of vacuum-tight, ultra-miniature electronic or optical devices with superior reliability. Even electronics with extreme heat sensitivities can be safely encapsulated. Glass micro bonding enables entirely new packaging concepts for devices that demand high reliability including medical implants, aerospace, automotive, optical devices, and micro-electro-mechanical systems (MEMS) for the internet of things (IoT).
The transaction is expected to be completed before the end of 2018, subject to certain customary closing conditions. The parties have agreed to maintain confidentiality regarding the purchase price.
Upon finalisation of the acquisition, the company will conduct its business activities under the new name Schott Primoceler based in Tampere, Finland, as part of Schott’s Electronic Packaging division. This division offers a complete range of hermetic packaging technologies to protect sensitive electronics in automotive, aerospace, medical, and energy applications, among others.
'This new partnership with such a global leader positions us excellently to serve our customers around the world and scale up our production,' said Ville Hevonkorpi, CEO of Primoceler Oy.
Primoceler has been using various glass types and products from Schott, such as HermeS glass wafers. These substrates come with hermetically sealed miniature connections that go through the glass (also known as 'through glass vias,' or TGV), enabling highly reliable packaging for micro-sensors and other MEMS.
'With this acquisition, we further strengthen our leading position and advance our growth strategy,' explained Peter Kniprath, head of Schott’s business unit Electronic Packaging. 'Electronics are entering more and more areas of our daily life. As a part of this, demands for safety and durability have increased. Schott Primoceler Oy will focus on tackling these challenges and working with our customers towards completely new applications.'
