FiconTEC has released its next-generation AL2000 automated photonic devices assembly system.
The AL2000 platform consists of six-degrees of independent axes for submicron precision alignment that addresses all possible degree of optical (and mechanical) axes, and almost equally accurate pick-and-place positioning capability.
It provides various bonding options, including both UV- and thermal-epoxy, soldering, and laser welding with about 1μm post-bond-shift accuracy.
Various fully automated assembly processes have already been implemented, including: FTTx transceiver assembly, laser array assembly, pressure sensors, miniature camera, micro-lens positioning and assembly (via epoxy dispensing), miniature solid state laser assembly and planar parallel placement of CCD-arrays.