Semiconductors PIXEurope pilot line marks out Europe’s leadership bid for Photonic Integrated Circuit (PIC) production The Chips Joint Undertaking (Chips JU) launches PIX Europe, the EU-backed pilot line for PICs, signalling Europe’s ambitions to lead innovation and production in the growing sector, and strengthen its semiconductor sovereignty. Latest Content MIT-spin off's lab-on-a-chip enables blood tests at home Lightmatter and Amkor collaborate to deliver largest 3D-packaged photonic chip for AI Transparent semiconductor material enables optical devices in harsh environments White papers New active ring resonators using mid-infrared QCLs Read this White Paper to find out how photonic integrated circuits (PICs) applications could benefit from active ring resonators using quantum cascade laser (QCL) sources to open up applications in the mid-IR range Optimizing System Performance: A Guide to Specifying Laser Modules Choosing the right laser module requires careful consideration of the specific requirements of the application, as well as a thorough understanding Semiconductor packaging: from concept to commercialisation A comprehensive walk through of the various stages of package development in the semiconductor industry More content Scintil Photonics raises €13.5m in second funding round Semiconductor packaging: from concept to commercialisation World's first polarisation-based photonic processor developed Looking skyward: Photonics opportunities in space Open silicon photonics platform offers laser integration at scale VCSELs rev up for life in the fast lane Lead appointed for PCSEL Knowledge Transfer Partnership Subsidising a way out of semicon shortages Okmetic to double silicon wafer capacity with €400m facility in Finland Ligentec opens PIC research centre in France Dutch photonic chip ecosystem PhotonDelta secures €1.1bn funding Back from the future: 2030 photonics Pagination Previous page ‹ Previous Page 20 Next page Next ›
