Semiconductors PIXEurope pilot line marks out Europe’s leadership bid for Photonic Integrated Circuit (PIC) production The Chips Joint Undertaking (Chips JU) launches PIX Europe, the EU-backed pilot line for PICs, signalling Europe’s ambitions to lead innovation and production in the growing sector, and strengthen its semiconductor sovereignty. Latest Content MIT-spin off's lab-on-a-chip enables blood tests at home Lightmatter and Amkor collaborate to deliver largest 3D-packaged photonic chip for AI Transparent semiconductor material enables optical devices in harsh environments White papers New active ring resonators using mid-infrared QCLs Read this White Paper to find out how photonic integrated circuits (PICs) applications could benefit from active ring resonators using quantum cascade laser (QCL) sources to open up applications in the mid-IR range Optimizing System Performance: A Guide to Specifying Laser Modules Choosing the right laser module requires careful consideration of the specific requirements of the application, as well as a thorough understanding Semiconductor packaging: from concept to commercialisation A comprehensive walk through of the various stages of package development in the semiconductor industry More content £6.1m project to create silicon optical integrated circuits Two prototype PIC packaging platforms launched by EU pilot line Thinner crystals, smaller chips Smart Photonics receives €35m to accelerate photonic chip manufacturing PIC method set to speed-up coherent lidar New phase noise filter could enable cheaper compact lasers Diagnosis on a chip Team demonstrates photonic microwave generation using on-chip optical frequency combs Graphene dreams Integrated future Communication in optics systems generation UC Berkeley researchers extend perovskite spectral range with blue LED Pagination Previous page ‹ Previous Page 23 Next page Next ›
