Saki Corporation, an innovator in the field of automated optical inspection equipment, will demonstrate its BF-3Di automated optical inspection system at SMT Hybrid Packaging, Nuremberg, Germany, May 5-7 2015, in Stand 7-331.
Saki's BF-3Di and BF-3Si are true 3D algorithm-based inspection systems with 1 micron resolution. They have interchangeable platforms, offering flexibility and providing an economical solution if applications necessitate changing from automated optical inspection to solder paste inspection or vice versa. The change can be made by a Saki technician in a matter of hours and only requires a software adjustment and some tooling.
Saki's 3D optical inspection system has a unique 4-way projection system and uses a special liquid crystal on silicone (LCoS) module, not a blade and light source. The pitch of the light is not fixed, but rather is modified to provide a wider lighted area to accommodate different pitch heights, eliminating shadows and providing a brighter image and greater area from which to capture inspection data. The 3Di inspects heights up to 20mm and parts as small as 01005s, capturing reversed or inclined components with an escape of less than 1 ppm. It provides high-speed, real-time measurement for a broad range of substrate coverage and inspection data that is quickly and easily generated from CAD data to greatly reduce programming and debugging time. Inspection and detection of dry joints, lifted leads, and lifted microchips is accomplished with high accuracy.
"Saki's 3D inspection systems are built on 20 years of proven 2D imaging technology and over 10,000 fielded units," said Katsuhiro (Eddie) Ichiyama, general manager, Saki Europe. "Saki has a complete line-up of 3D inspection solutions -- SPI, AOI, and X-ray. Our equipment is geared for applications where board failure is not an option. We invite all PCB manufacturers who want to ensure that their products are of the highest quality to stop by our booth at SMT Nuremberg and talk to our technical experts."