Semiconductors Expansion and development at Physik Instrumente Physik Instrumente expands its product range and capacity with new Z-Tip-Tilt stage and new building. Latest Content Chip packaging sovereignty: $1.6bn new US funding, Europe’s industry “must link up” US defence agency grants $8m for ultra-sensitive PIC detectors AI tool helps to predict optical properties faster than ever White papers New active ring resonators using mid-infrared QCLs Read this White Paper to find out how photonic integrated circuits (PICs) applications could benefit from active ring resonators using quantum cascade laser (QCL) sources to open up applications in the mid-IR range Optimizing System Performance: A Guide to Specifying Laser Modules Choosing the right laser module requires careful consideration of the specific requirements of the application, as well as a thorough understanding Semiconductor packaging: from concept to commercialisation A comprehensive walk through of the various stages of package development in the semiconductor industry More content Chip packaging sovereignty: $1.6bn new US funding, Europe’s industry “must link up” US defence agency grants $8m for ultra-sensitive PIC detectors AI tool helps to predict optical properties faster than ever Photonic chip industry leaders meet at PIC Summit 2024 New ZEISS President and CEO set to step into role in 2025 IBM open first quantum data centre in Europe and expand operations in U.S Dual-sided chip combines photonic/electronic functions simultaneously Expansion and development at Physik Instrumente Semiconductor manufacturing to continue at Newton Aycliffe site acquired by UK Defence InSpek raises €6 million in funding from seed round and EIC grant OpenLight and Epiphany agree PIC-focused partnership Second firm gets major funding for TFLN PIC technology Pagination Page 1 Next page Next ›