Semiconductors Expansion and development at Physik Instrumente Physik Instrumente expands its product range and capacity with new Z-Tip-Tilt stage and new building. Latest Content Chip packaging sovereignty: $1.6bn new US funding, Europe’s industry “must link up” US defence agency grants $8m for ultra-sensitive PIC detectors AI tool helps to predict optical properties faster than ever White papers New active ring resonators using mid-infrared QCLs Read this White Paper to find out how photonic integrated circuits (PICs) applications could benefit from active ring resonators using quantum cascade laser (QCL) sources to open up applications in the mid-IR range Optimizing System Performance: A Guide to Specifying Laser Modules Choosing the right laser module requires careful consideration of the specific requirements of the application, as well as a thorough understanding Semiconductor packaging: from concept to commercialisation A comprehensive walk through of the various stages of package development in the semiconductor industry More content AI demand drives need for data and energy efficiency: Photonics provides an answer at ECOC 2024 Creating metrology solutions for material and semiconductor, energy and environment & life science applications The importance and complexity of scaling up photonic integrated circuit (PIC) production Photonics start-up raises $7m to commercialise TFLN chip foundry service Dutch government funds PIC measurement method Morphotonics raises $10m for scalable display optics production tech Second ever UK-Taiwan semiconductor dialogue held at SEMICON event PIC beam shaping behind laser communications first World-leading ‘Attomicroscope’ captures freeze frames of electrons Silicon photonic modulator brings quantum compass goal a step closer Nearfield Instruments semiconductor aims backed by €135m Experts call for EU investment to match China’s photonic progress Pagination Previous page ‹ Previous Page 2 Next page Next ›