Semiconductors PIXEurope pilot line marks out Europe’s leadership bid for Photonic Integrated Circuit (PIC) production The Chips Joint Undertaking (Chips JU) launches PIX Europe, the EU-backed pilot line for PICs, signalling Europe’s ambitions to lead innovation and production in the growing sector, and strengthen its semiconductor sovereignty. Latest Content MIT-spin off's lab-on-a-chip enables blood tests at home Lightmatter and Amkor collaborate to deliver largest 3D-packaged photonic chip for AI Transparent semiconductor material enables optical devices in harsh environments White papers New active ring resonators using mid-infrared QCLs Read this White Paper to find out how photonic integrated circuits (PICs) applications could benefit from active ring resonators using quantum cascade laser (QCL) sources to open up applications in the mid-IR range Optimizing System Performance: A Guide to Specifying Laser Modules Choosing the right laser module requires careful consideration of the specific requirements of the application, as well as a thorough understanding Semiconductor packaging: from concept to commercialisation A comprehensive walk through of the various stages of package development in the semiconductor industry More content IBM open first quantum data centre in Europe and expand operations in U.S Dual-sided chip combines photonic/electronic functions simultaneously Expansion and development at Physik Instrumente Semiconductor manufacturing to continue at Newton Aycliffe site acquired by UK Defence InSpek raises €6 million in funding from seed round and EIC grant OpenLight and Epiphany agree PIC-focused partnership Second firm gets major funding for TFLN PIC technology AI demand drives need for data and energy efficiency: Photonics provides an answer at ECOC 2024 Creating metrology solutions for material and semiconductor, energy and environment & life science applications The importance and complexity of scaling up photonic integrated circuit (PIC) production Photonics start-up raises $7m to commercialise TFLN chip foundry service Dutch government funds PIC measurement method Pagination Previous page ‹ Previous Page 3 Next page Next ›
