Semiconductors Expansion and development at Physik Instrumente Physik Instrumente expands its product range and capacity with new Z-Tip-Tilt stage and new building. Latest Content Chip packaging sovereignty: $1.6bn new US funding, Europe’s industry “must link up” US defence agency grants $8m for ultra-sensitive PIC detectors AI tool helps to predict optical properties faster than ever White papers New active ring resonators using mid-infrared QCLs Read this White Paper to find out how photonic integrated circuits (PICs) applications could benefit from active ring resonators using quantum cascade laser (QCL) sources to open up applications in the mid-IR range Optimizing System Performance: A Guide to Specifying Laser Modules Choosing the right laser module requires careful consideration of the specific requirements of the application, as well as a thorough understanding Semiconductor packaging: from concept to commercialisation A comprehensive walk through of the various stages of package development in the semiconductor industry More content French and German Presidents visit Fraunhofer Institute, strengthening political ties to photonics research Hamamatsu completes NKT Photonics acquisition Sales of silicon photonics chips set to top $3bn by 2029 ASML invests €80m in TU/e to fund 100 semiconductor PhDs, new cleanroom ASML and TU/e agree to invest $195m into semiconductor research Light coupling method enables on-chip multiplexed microtoroid sensing platform Optical modulation of gold offers control of nanoscale plasmons Low-temperature pulse irradiation method enables scalable flexible optoelectronics Emerging compound semiconductor applications beyond optical communications UK announces independent institute to lead government semiconductor strategy Organic infrared photodetectors may advance imaging technology Lithium tantalate platform could enable cheaper, more scalable PICs Pagination Previous page ‹ Previous Page 4 Next page Next ›