Semiconductors Expansion and development at Physik Instrumente Physik Instrumente expands its product range and capacity with new Z-Tip-Tilt stage and new building. Latest Content Political figureheads visit imec's research centre ahead of the opening of Spanish facility Start-up VitreaLab hires new CEO to scale up PIC light engines Chip packaging sovereignty: $1.6bn new US funding, Europe’s industry “must link up” White papers New active ring resonators using mid-infrared QCLs Read this White Paper to find out how photonic integrated circuits (PICs) applications could benefit from active ring resonators using quantum cascade laser (QCL) sources to open up applications in the mid-IR range Optimizing System Performance: A Guide to Specifying Laser Modules Choosing the right laser module requires careful consideration of the specific requirements of the application, as well as a thorough understanding Semiconductor packaging: from concept to commercialisation A comprehensive walk through of the various stages of package development in the semiconductor industry More content New Jenoptik optical solutions to increase output, streamline component testing Photonic integration technique addresses III-V and silicon mismatch Chip calculates at light-speed to advance AI, computing PIC-based cardiac diagnostic device receives £1.5m for clinical trials Portable PIC-based OCT device awarded $20m from US government LDFZ process creates record-sized crucible-free crystals New process maps light inside integrated circuits, advancing design of photonic chips Smart Photonics moves to 4-inch wafers to scale up photonic chip production Laser printer makes photonic chip fabrication more accessible Three integrated photonics acquisitions in two days 'a strong signal' for quantum scaling What are the advantages and challenges of using laser technology for encapsulation processes? New method embeds optical circuits within commercial fibres Pagination Previous page ‹ Previous Page 7 Next page Next ›